- Seminar on the First Round of Invitation for Applications for Establishment of Hong Kong Branches of Chinese National Engineering Research Centres and the Re-assessment of Partner State Key Laboratories held successfully on 4 March 2014 (Chinese only)
- The first round of funding applications for 2014 under Tier 2 and Tier 3 of the Innovation and Technology Support Programme (ITSP) is now open to application. Deadline for application is 31 March 2014. For details, please visit www.itf.gov.hk.
- The National Twelfth Five-year Plan on Science and Technology Development - Science and Technology Areas where Hong Kong Possesses a Competitive Edge" (June 2013 Version) (Chinese only)
- Innovation and Technology Scholarship Award Scheme